Rehm Showcases Innovations at SMT Hybrid Packaging 2018

Every year, SMT Hybrid Packaging addresses current topics related to electronics manufacturing and puts these in the focus of the event. This year, it is all about the ever-growing field of digitalization, the fourth industrial revolution, and smart factory.

At the upcoming SMT Hybrid Packaging 2018 show in June 5–7, Rehm Thermal systems will be presenting innovative solutions for augmented reality that are an important part of the new ViCI virtual communication interface for the ViCON system software. Visitors can experience the first demo version of this innovative portal solution live in Rehms stand at Hall 4A Booth 100.

For a long time, it was common practice to always showcase the latest systems technology of the manufacturing equipment at the leading trade fairs for electronics manufacturing. These days, software solutions belonging to SMT manufacturing are playing an ever-increasing role.


For more details:

• Focus on the official WeChat subscription:NEPCONacrosschina; The official weibo:NEPCON China电子展

• NEPCON South China For details, please

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