China's semiconductor materials status (electronics manufacturing expo news)

20 Jul 2019

The so-called clever woman is hard to be without rice, there is no semiconductor material, and the EUV lithography machine worth hundreds of millions of dollars is just a large brick. In the recent Japanese-Korean electronics manufacturing expo trade war, the Korean semiconductor industry has been locked in the throat of fate because Japan has restricted the export of key semiconductor materials, and semiconductor materials have become the focus of attention.

Japan has one of the most complete semiconductor industry chains in the world. And in terms of upstream semiconductor equipment and materials, Japanese manufacturers also have a very high market share. Therefore, the strong first semiconductor echelon like South Korea will be subject to Japan.

Although there have been news reports that Samsung, such as Samsung and SK Hynix, which have already begun to be affected, have contacted several Chinese manufacturers to increase the supply of chemical materials. But this is only a short-term positive for the Chinese semiconductor industry. Once the relationship between Japan and South Korea resumes, Chinese manufacturers still need to face obvious product quality and capacity gap.

The war between Japan and South Korea should be two-fold for China's semiconductor industry. First, Chinese semiconductor material manufacturers need to continuously improve electronics manufacturing expo product quality and strive to catch up. Secondly, China's IC manufacturing and packaging and testing industry cannot rely too much on imported materials.

It is understood that semiconductor materials mainly include wafer manufacturing materials and packaging test materials. Among them, wafer fabrication materials include silicon wafers, photoresists, photomasks, electronic specialty gases, wet chemicals, sputtering targets, CMP polishing materials, etc.; packaging materials include lead frames, substrates, ceramic electronics manufacturing expo packaging materials, Bond wire, encapsulating resin, chip mounting material, and the like.

Among the above-mentioned semiconductor materials, in terms of packaging materials, China's high-end bonding wire, package substrate, lead frame and other packaging materials are still highly dependent on imports, but with the rise of China's packaging and testing companies in recent years, China's packaging electronics manufacturing expo materials are constantly being obtained. breakthrough.

As the most important material in the semiconductor manufacturing process, silicon wafers, photoresists, photomasks, electronic specialty gases, wet chemicals, sputtering targets, and CMP polishing materials account for the highest electronics manufacturing expo proportion of all semiconductor materials. What are the current status of these materials in China?

Silicon wafer

Shin-Etsu Chemical and Seco's two Japanese silicon fabs have a 50% market share worldwide, and South Korea's LG Siltron accounts for 9%. Chinese manufacturers include Taiwan Global Crystal, Taiwan Hejing, Shanghai Xinsheng, Central Semiconductor and Xinhua Semiconductor. However, the world's top five silicon fabs (Shin-Etsu Chemical, Seco, Universal, Germany, and LG Siltron) account for more than 90% of the entire market.

On the mainland side, the localization rate of 8-inch silicon wafers is only 20%, and the 12-inch silicon wafers are almost entirely imported. As of the end of last year, according to the electronics manufacturing expo capacity disclosed by each company's mass production line, the 8-inch silicon wafer production capacity has reached 1.39 million pieces / month, the capacity in construction is 2.7 million pieces / month; the 12-inch silicon wafer capacity is 285,000 pieces. / month, the capacity under construction reached 3.15 million pieces / month.

However, as the main body of China's first 12-inch silicon wafer project, Shanghai's new 12-inch silicon wafer has passed the certification of China's major manufacturers such as SMIC and Huali Microelectronics, and achieved sales of some products. In addition, it is said that Shanghai Xinsheng is in the process of impacting the board, and hopes to accelerate the pace of development after the successful listing, and lead the Chinese silicon wafer industry to the international advanced level.


Japanese and American companies have almost monopolized the photoresist market, accounting for more than 90% of the market. Foreign manufacturers mainly include Japan JSR (28%), Tokyo Yinghua (21%), Shin-Etsu Chemical (13%) and electronics manufacturing expo Fuji Electronics (10%), as well as Dow Chemical in the United States and Dongjin Shimeiken in Korea.

In China, the localization rate of semiconductor wafers for 8-inch and above is less than 1%, and the overall photoresist self-sufficiency rate is only 10%. It is understood that there are less than five companies in China that are really engaged in the research and production of photoresists for integrated circuits. However, the Sino-US joint venture Beijing Kehua is in a strong momentum, and the company's electronics manufacturing expo products have already entered the supply system of SMIC, China Resources Shanghua, Hangzhou Silan and Sanan Optoelectronics. Its 248nm photoresist has been certified by some customers including SMIC, and 193nm photoresist is also in the research and development stage.

Another i-line photoresist from Jingrui has also passed the SMIC test. In June, the company's 1.5 billion yuan Jingrui microelectronics material project in Qianjiang City was mainly used to produce photoresist and related functional electronics manufacturing expo materials, electronic grade hydrogen peroxide, electronic grade ammonia and other semiconductor and panel displays. Electronic materials, etc.

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