China's first ultra-low power storage integrated AI chip came out(China PCB show news)

20 Jul 2019

Recently, the demonstration of the Computing In Memory AI chip system based on NOR flash architecture jointly developed by Hefei Hengshuo Semiconductor China PCB show Technology Co., Ltd. and China University of Science and Technology team has been successfully completed.

It is understood that the chip is an artificial intelligence chip with edge calculation and reasoning. It can detect the face avatar taken by the camera in real time and give the calculation probability. It is accurate and stable, and can be widely used in face China PCB show recognition in forest fire prevention. Rescue, real-time monitoring of ECG, hardware solutions for artificial intelligence on face recognition, etc.

According to the Hefei Daily, this marks the China PCB show birth of artificial intelligence chips with China's independent intellectual property rights, China's first and internationally leading ultra-low power consumption.

One of the R&D team members, Dr. Tao Linfeng of the Chinese University of Science and Technology, introduced the China PCB show integration of storage and computing. In the traditional calculation process, the computing unit needs to extract the data from the storage unit, and then write back to the storage unit after the processing is completed. The integration of the China PCB showcalculations saves the data handling process and improves the computing performance.

Compared with the traditional chip, the integrated China PCB show arithmetic intelligent chip has the characteristics of low energy consumption, high computing efficiency, high speed and low cost.

According to the official website, Hefei Hengshuo Semiconductor Technology Co., Ltd. was registered in Hefei City in February 2015, has a research and development center in Shanghai Pudong Hi-Tech Park, and has a 3D NAND joint China PCB show development laboratory and testing center at the China University of Science and Technology. In addition, the company has established strategic partnerships with a number of wafer fabrication and packaging facilities to jointly develop NAND, NOR flash, EEPROM and other new China PCB show memory products.

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