Testing modules and multi-chip packages in the full temperature range

10 Aug 2018

Xcerra’s MT2168 XT Semiconductor Test Handler installed as a flexible and efficient alternative to dedicated module test solutions The Xcerra MT2168 XT pick-and-place handler was installed for a tri-temp module test application at a major player in global semiconductor manufacturing. With its innovative features and highly flexible design the MT2168 XT meets the growing demand in high volume production for reliable and cost-efficient tri-temp test handling of multi-chip packages and modules in the automotive and consumer markets.

Today’s available equipment for module test handling are dedicated solutions with low throughput and limited temperature test capabilities. Xcerra’s MT2168 XT addresses the market need for a high volume production test solution for modules. The MT2168 XT leverages the industry-known tri-temperature expertise of the Xcerra Handler Group specialists and provides advanced technical features of the latest generation of pick-and-place handler. Additionally, the MT2168 XT is superior to traditional module test solutions when it comes to typical high volume production requirements such as the number of supported binning classes, small footprint, spare part and service support.

The MT2168 XT can be used for handling both package devices and modules. Xcerra’s module test solution gives customers the greatest flexibility in high volume production with quick and easy change between different package types and different size modules. Handling and testing modules can be challenging due to the physical dimensions and heterogeneous architecture of modules.

The MT2168 XT independent plunger force and temperature control provides better ability to handle modules and precisely control power dissipation for high test yield. Integrating contacting solutions from Xcerra’s Interface Product Group can be an additional advantage for module testing. Extensive understanding of test contacting is beneficial for complex modules of different shapes and sizes.

Dr. Laurie Wright, Director Global Business Development, explains: “There is a growing demand in the semiconductor market for module test handling as customers seek to deliver greater value to their end customers. The MT2168 XT brings the advantages from high volume package test to module test. Customers will benefit from this highly flexible and reliable tri-temperature test solution that can address a wide range of their high volume production requirements.” To learn more about the Xcerra MT2168, please visit www.xcerra.com/MT2168


For more details:

• Focus on the official WeChat subscription:NEPCONacrosschina; The official weibo:NEPCON China电子展

• NEPCON South China For details, please visit:www.nepconsouthchina.com

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