Selective Wave Soldering Process Design Guide[electronic equipment China Knowledge]

11 Jul 2019

Selective wave soldering process design guidelines to achieve optimal soldering electronic equipment China results, meeting special process conditions.

High standard process reliability depends on the following points:

  • Pad design (pad type, distance between pads)
  • Pad and peripheral component pad distance (eg, should not touch SMD device)
  • The length of the PIN pin should not exceed the length of the PIN pin under the board
  • PIN foot spacing (eg, connector spacing)

These influence factors directly affect the peeling of the flowing solder. In order to avoid the occurrence of tin bridges, repeated stripping is required. Tin bridge is the main cause of welding failure (more than 80%). In general, there are significant differences between the small drag welding process and the dip soldering process. Each process requires a special printed circuit board design. The following design guidelines ensure optimum process conditions. If you do not follow the electronic equipment China recommendations below, the process window will be limited and additional steps will be required to stabilize the process. These extra steps require more maintenance and increase wear on the mold parts.

Optimal layout of the dip soldering process

Clearance between pads

  • Priority use of round pad
  • Distance between round pads: >0.60mm
  • PIN foot distance: >2.54mm

The length of the PIN pin should not exceed the length of the PIN pin under the board

  • Solder nozzle gap - distance to adjacent pad (not soldered)
  • On the 3rd side: > 3.0mm
  • On the fourth side: > 5.0mm
  • Microwave / drag welding process optimal layout

Clearance between pads

  • Priority use of round pad
  • Distance between round pads: >0.60mm
  • PIN foot distance: > 1.9mm

PIN pin length should not exceed the board

Microwave gap - distance to adjacent pad (not soldered)

  • On 3 sides: > 2.0mm
  • On the fourth side: > 5.0mm

Minimum size of solder nozzle

  • Rectangular solder nozzle
  • Welding area 40mm2
  • Round solder nozzle
  • Welding zone 7mm2

Maximum height of adjacent components

The maximum component height that the bottom (welding surface) can accommodate is limited by the height of the electronic equipment China solder nozzle. The standard solder nozzle height is 32mm. Therefore, the maximum component height should not exceed 25mm. Higher components require a higher solder nozzle design and we can design according to your requirements.

In addition, the distance between each component and the solder joints needs to be noted to prevent the components from contacting the nitrogen hood during the drag welding process. For example, if the component height exceeds 10 mm, a solder fillet will appear in this process. Rule of thumb: The angle of the weld appears and the component exceeds 10 mm. Component height (mm) ≤ distance to solder joint (mm)

About NEPCON ASIA

NEPCON ASIA Asia Electronics Manufacturing Equipment & Microelectronics Industry Exhibition will be held at the Shenzhen Convention and Exhibition Center on August 28-30. The exhibition area is expected to be 60,000 square meters, which is the largest electronic equipment China NEPCON exhibition. Six exhibitions are combined to create a connectivity platform for the electronics manufacturing industry. As an international quality exhibition of electronic manufacturing industry, it is expected that 800 exhibitors and brands from 38 countries and regions, and 60,000 professional visitors from the electronics manufacturing industry will participate in the NEPCON ASIA exhibition. The 5G theme will showcase new technologies and products from printed circuit boards, electronic equipment China circuit board assembly, automated assembly, and testing to electronic manufacturing.

In 2019, the exhibition will focus on the core needs of the electronics manufacturing industry, focusing on the themes of digital manufacturing, lean production, product reliability, and industrial applications for communications, automotive, new energy, and smart cities. The exhibition will provide you with personalized electronic equipment China recommendations. You can participate in three-day exhibitions, meet face-to-face with electronics industry suppliers, negotiate orders, participate in live events, attend conference forums, learn industry knowledge, and achieve self-improvement to help companies achieve purchases. And business cooperation purposes.

Leading Exhibitors

electronic equipment China
Recommended Exhibition
China PCB show
SMT Exhibition
Join and Follow Us
Exhibition Hours
Day Time
Wednesday, August 26 10:00-17:00
Thursday, August 27 09:30-17:00
Friday,August 28 09:30-16:30
Visitor Hotline
International Callers:86-21-2231-7105
From within China:400-650-5611

We use cookies to operate this website and to improve its usability. Full details of what cookies are, why we use them and how you can manage them can be found by reading our Privacy & Cookies page. Please note that by using this site you are consenting to the use of cookies.