TSMC's 5nm process will be mass-produced next year(China PCB show News)

22 Jul 2019

On the evening of July 19, according to the US technology China PCB show website AppleInsider, TSMC Chief Financial Officer (CFO) He Limei said today that TSMC's 5nm manufacturing process is expected to be mass-produced in the first half of 2020, driven by the demand for 5G smartphones. Apple's next-generation China PCB show A-series processors will be the first to adopt a 5nm manufacturing process.

He Limei said that Apple's iPhone, other smart phones and IoT devices are expected to become the main driving force for TSMC's third-quarter China PCB show performance growth. TSMC expects that chip demand will continue to grow in the second half of this year, with the fourth quarter being even stronger, mainly due to the strong demand for smartphone chips.

He Limei also said that the growing demand for 5G China PCB show smart phones and base station equipment will be the main driving factor for the growth of demand for related parts for the rest of the year. Currently, TSMC is using its advanced and mature processes for chip production in these areas.

In addition, TSMC CEO Wei Zhejia also told investors on Thursday that TSMC has become "more aggressive" in the China PCB show production of 5 nanometer chips, and is expected to achieve mass production of 5 nanometer chips in the first half of 2020. Wei Zhejia believes that the growth of 5G China PCB show demand will drive production demand based on 5 nanometers and 7 nanometers.

For Apple, the current generation of A12 processors are manufactured on a 7-nanometer process, and the A13 processor, which is expected to be released this fall, will remain at this level. Since Apple is a major China PCB show customer of TSMC, the A14 processor next fall is likely to use TSMC's 5nm manufacturing process.

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