Why Intel delays application of 10nm process(China PCB show news)

23 Jul 2019

Recently, Intel CEO Bob Swan talked about some topics related to the company, including some of the reasons for the delay in the 10nm. He said: "On the point of the China PCB show art that is becoming more and more difficult, we But a more radical goal has been set. Since then, the completion of new processes has been delayed."

Intel's 14nm process has been in use for almost five years since it was officially launched in late 2014. It may be Intel's longest used China PCB show process in more than a decade.

Process development is becoming more and more difficult, and time to defer formal use again and again has forced Intel to revise their China PCB show product plans and roadmaps over and over again over the past few years.

14nm also experienced an extension in the early stage, which led to the partial failure of Intel's Tick-Tock strategy. Broadwell, which should have been launched in mid-2014, is a five-generation China PCB show Core. Because of the 14nm extension, Intel introduced the Haswell Refresh series. The classic China PCB show E3-1231V3 and i7-4790k are the products of this Refresh.

In the past few years, due to the serious delay of the 10nm process, the Tick-Tock strategy was completely abandoned, and the process was deeply excavated. So we saw the products of the eight generations and nine China PCB show generations of Core II 14nm++ process, and even It is possible to see the 14th+++ 10th generation Core at the end of this year or next year.

In the goal of the 10nm China PCB show process, Intel initially set a goal of increasing transistor density by 2.7 times compared to the 14nm process. This radical goal made 10nm encounter a considerable degree of difficulty, resulting in continuous delay. When Bob Swan was asked about the 7nm node China PCB show problem after 10nm, he replied that this time they set a goal to increase the density by a factor of two, and revealed that 7nm is already under development and will be officially launched within two years.

Intel currently has a few companies that combine the design of high-performance chips with the manufacture of China PCB show state-of-the-art process chips. The insistence on using their own processes on the CPU has made them tired of the challenges that AMD has faced in the past two years. Not long ago, there were news reports. Intel will choose a third party to create its own new GPU. It also shows that they are in a period of shortage in terms of capacity. I hope that Intel can survive this difficult time and continue to lead the China PCB show industry as a leader in the semiconductor industry.

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