SMTA China South Technical Conference

NEPCON China现场技术工作坊 技术研讨会日程, SMT工程师培训课程, 参会预登记



28th-29th August 2019
Shenzhen Convention & Exhibition Center
Shenzhen, China

SMTA China South
Technical Conference 2019 Programme

8.28
(Wednesday)
8.29
(Thursday)
8.30
(Friday)

Technology Conference

10:30-15:30
10:30-16:05

Vendor Conference

10:30-15:25
10:30-15:25

Exhibition


Nepcon asia

 


中国SMTA将于2019年8月28-29日在深圳举办SMTA华南高科技会议2019。此次会议与第二十四届华南国际电子生产设备暨微电子工业展览会同期举办。此次会议将涉及行业中热门的话题,包括先进封装及元件,装配, 商业与供应链, 新兴技术, 环保应用 (军工、航天、汽车、工业、石油天然气), 基板技术, 制程控制。

Technology Conference/Vendor Conference (28th-29th August 2019)

Topic:

* Applications of Artificial Intelligence In SMT Logistics Management
* SMT Rework Difficult Problem Discovery
* Mastering eMMC Device Programming
* Limits In The Process of Selective Soldering Applications and Special Solutions of NEOTEL/INERTEC Technology
* Limits In The Process of Selective Soldering Applications and Special Solutions of NEOTEL/INERTEC Technology
* Dispensing Machine Solution for Thermal Interface Material
* Electromigration Behavior of BGA Structure Mixed Assembled Cu/Sn-Ag-Cu/Sn-Bi/Cu Joints
* Pillarhouse Selective Soldering System
* Applications of Artificial Intelligence In SMT Logistics Management
* The Latest Component Counting Trend -X-Ray Component Counting and Data Sharing With MES
* ICT+MultiWriter for Multi-Panel
* Smart Shelf Material Management Solution
*Multi Function 3D Measurement
* Automated Optical Bonding Solution for Automotive Display
* Mastering eMMC Device Programming
* The Application of AI In 3D AOI&Multi-Line Function Technology
* Management Overview of The Smart Factory (Industry 4.0) Principles and Affects In Electronics Manufacturing
* High Power Electronics: Cleaning Requirements for Improved Efficiency and Reliability
* Investigation In Failure Analysis and Case Study of HiP
* Preventing Corrosion of Electronic Components By Supply Chain Management
* Study On Variation Trend of PCB Conductor Adhesion With The Thermal Aging Test
* Study On Moisture Absorption and Baking for Moisture Sensitive Devices
* Ni Plate Peel-off Mechanism Study On Li-ion Battery Protection Board
* New Generation Sn57Bi1AgX Low Temp Solder for SMT Assembly
* The Impact of Alloy Composition On Shear Strength for Low Temperature Lead Free Alloys
* Thermal Shadow Moiré To Cross-Section Correlation Study
* The Benefits of Plasma Treatment In Electroincs Manufacturing
* An Ultra-Thin, Water and Corrosion-Resistant, Halogen-Free Conformal Coating for Protection and Reliability of Critical and Consumer Electronics
* An Update On High Reliability Lead-Free Solder Alloys
* The Effect of pH: Cleaning Agent Properties and Performance In Production

2019年华南高科技会议最佳创新展品大奖和最佳展品技术大奖的提名 (2019年8月28日)

这是一个很好的机会在中国SMTA 周年颁奖典礼上与我们业界的朋友们见面. 另外, 为了感谢演讲者们在高科技研讨会和高科技设备技术研讨会中优秀信息的分享, 中国SMTA将于8月28日在深圳举办的高科技设备技术研讨会现场举办的中国SMTA 周年颁奖典礼上颁发最佳论文奖和最佳演讲奖。

Inquiry and Registration:
Email: peggychen@smta.org.cn

Leading Exhibitors

electronic equipment China
Recommended Exhibition
China PCB show
SMT Exhibition
Join and Follow Us
Exhibition Hours
Day Time
Wednesday, August 28 10:00-17:00
Thursday, August 29 09:30-17:00
Friday,August 30 09:30-16:30
Visitor Hotline
International Callers:86-21-2231-7105
From within China:400-650-5611

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