2023 IC Packaging Fair

Focusing on IC design companies and OSAT, combining existing resources, i.e. OEM/EMS of electronic manufacturing service providers, ODM, OBM of electronic brands, highly integrated industry through the concept of IC Packaging + PCBA, leading the development trend of advanced packaging industry; focusing on IC software, packaging test equipment, materials, automated production, and packaging test services;

The exhibition area will attract core buyers from 5G, IoT, wireless communication, automotive electronics, medical electronics, computer, military electronics, and other industries' packaging and testing businesses, semiconductor design companies, electronic product design solution companies, and electronic brand OBMs. 

◉   The industry's rare " semiconductor manufacturing " business matching and industry exchange learning platform.

◉   Presenting semiconductor wafer manufacturing, semiconductor packaging, testing technology in the form of "demonstration + conference + technology and business exchange"

◉   Strongly expanding the South China semiconductor packaging and testing industry target customers， are expected to attract 100 South China semiconductor packaging and testing enterprises

◉   Concurrent shows with NEPCON Asia such as ES SHOW electronic components exhibition, AWC automotive electronics industry exhibition, etc., offer a one-stop event for semiconductors, MINI LED, automotive, and other new materials, solutions, and processes.

Semiconductor Packaging Conference

Session 1: SiP and Advanced Packaging Session

Sub-forum II: Compound Semiconductor Packaging Sub-forum