2022 Semiconductor Packaging Technology Exhibition IC Packaging Fair

The industry's rare "semiconductor packaging + MINI LED chip and test industry" business matching and industry exchange learning platform.

Presenting semiconductor packaging and testing technology and MINI LED chip and test industry in the form of "demonstration + conference + technology and business exchange".

Strongly expanding the South China semiconductor packaging and testing industry and MINI LED backlight module industry, target customers are expected to attract 100 South China semiconductor packaging and testing enterprises, 30 well-known IC design enterprises, 50 South China backlight module enterprises, 60 panel and end-product manufacturers, and other visitors to visit the meeting.

Concurrent shows with NEPCON Asia such as ES SHOW electronic components exhibition, AWC automotive electronics industry exhibition, etc., offer a one-stop event for semiconductors, MINI LED, automotive, and other new materials, solutions, and processes.

1 Strongly expand the South China semiconductor packaging industry and MINI LED backlight module industry target customers, participate in the conference presentations, and organise demonstrations for opportunities to match

• 100 semiconductor packaging and testing companies in South China
• 30 well-known IC design companies
• 50 backlight module enterprises in South China
• 60 panel and end-product manufacturing enterprises

2 For you to establish your brand image in semiconductor packaging and MINI LED industry, as well as announce your new applications in semiconductor packaging and MINI LED industry

3 For you to have access to more business cooperation opportunities, to connect with the semiconductor packaging and MINI LED industry, special equipment suppliers, equipment distributors, industry associations, professional media, etc.

4 Easy to participate but contains a wealth of docking opportunities—small investment for big returns

You only need to send professional sales and technical executives and bring the latest relevant equipment and the latest speech content can be

In addition to presentations and demonstrations, we will provide you with "online + offline procurement matchmaking" and access to attendee contacts.

Content One: Semiconductor Packaging

Conference: Semiconductor Packaging Conference

Estimated number of audiences: 1,000+

√ Session 1: SIP and Advanced Packaging Session

√ Session 2: Compound Semiconductor Packaging Session

Exhibition: Semiconductor Advanced Packaging Production Line Exhibition Area

Expected number of exhibitors: 25+

√ Display 1: SiP and advanced packaging production demonstration line

√ Demonstration 2: Wafer-level fan-out packaging production demonstration line

Categories of companies to be invited to visit:

√ 100+ South China packaging and test houses

√ 30 + IC design companies in South China

Content II: MINI LED packaging

Conference: 2022 Mini LED Chip and Packaging Solutions Forum

Expected number of audiences: 500+ people

Demonstration: MINI LED backlight module COB process line

Expected number of exhibiting companies and brands: 25+

Categories of enterprises to be invited to visit:

√ 50 + backlight module enterprises in South China

√ 60 + panel and end-product manufacturing enterprises

Concurrent Exhibitions.

NEPCON ASIA Asia (Hall 3 & Hall 5)

Expected to attract 50 + SiP advanced packaging manufacturing companies and brands to display.

Diagram of display area and meeting room: