November 6th-8th 2024
Shenzhen World Exhibition & Convention Center (Baoan)

Show Date: November 6th-8th 2024      

Venue: Shenzhen World Exhibition & Convention Center (Baoan)

Opening Hours:

Wednesday, November 6th 9:00 AM-5:00 PM

Thursday, November 7th 9:00 AM-5:00 PM

Friday, November 8th 9:00 AM-3:30 PM


Show Value

NEPCON ASIA serves as a vital sales channel and strategic partner for electronic manufacturing solution providers seeking to cultivate new business opportunities, engage with fresh clients, and secure new orders. With participation from over 60,000 domestic and international buyers in Asia's semiconductor packaging, testing, and other diverse application industries, the exhibition offers a comprehensive display of cross-industry electronic manufacturing solutions for global PCB assembly, semiconductor manufacturing, smart factories, automobile manufacturing, and touch display markets.

Positioned as a dynamic industry platform, NEPCON ASIA facilitates collaboration and exchanges among established and potential partners throughout the entire industrial chain and plays a pivotal role in enhancing the global competitiveness of Asian electronics manufacturing companies.


NEPCON ASIA 2024 Key Figures

60,000m2

Show Area

60,000

Visitors

600+ 

Brands

2,000 

Overseas Visitors

160,000㎡

Total Space of Concurrent Shows 

150,000

Total Visitors of Concurrent Shows 

3,500+ 

Total Exhibiting Brands of Concurrent Shows

5,000

Total Overseas Visitors of Concurrent Shows

Show Highlights

Global Leading SMT Companies to Appear at NEPCON ASIA

● Focus on innovative equipment, materials, and solutions in SMT surface mounting, testing and measurement, welding, dispensing and spraying, electronic manufacturing services, electronic manufacturing automation, printed circuit boards, and electronic materials.
● Feature exciting and interactive activities such as the SMTA South China Technology and Equipment Conference, innovation skill competitions in popular application industries.

IC Packaging Fair Focuses on New Opportunities and Leads a New Era of Packaging and Testing 

● Focus on the IGBT & SiC Manufacturing demonstration line, covering the entire production line chain from materials, design, and process to equipment, showcasing the latest technologies, products, and solutions in the industry.
● Discuss the latest technologies and developments in Advanced Wafer Fabrication, SIP & Advanced Packaging, and Compound Semiconductor Packaging.

S-Factory Injects Strong Impetus into Factory Upgrades in the Midst of Surging Industry 4.0

● Feature a combination of lighthouse factory visit, exhibitions and high-end conferences.
● Launch the Exclusive Luncheon for Executives, creating a zero-distance communication platform.
● Host a series of forums, focusing on technologies and solutions, such as warehousing, high-growth industry applications, industrial robots, Internet of Things, and automation management.

Overseas Demand Resurfaces, NEPCON Helps Tap into the Global Market 

● Overseas supply-demand matchmaking meeting that will feature over 2,000 overseas procurement delegations.
● A series of Country Day program and technical seminars will deepen understanding of domestic and overseas markets and policies.


Exhibits Profile

  • Laminating technology and equipment
  • Soldering equipment
  • Test and measurement equipment
  • Laboratory test and measurement equipment
  • PCBA section test and measurement equipment
  • Finished product assembly section test and measurement equipment
  • Dispensing and Coating Equipment
  • Electronic Materials & Antistatic
  • Other Surface Mount Technology
  • Industrial Robotics
  • Finished product assembly automation integration
  • Automated Warehousing & Logistics
  • Transmission / Pneumatic Equipment & Accessories
  • Motion Control Equipment
  • Machine vision and sensing technology
  • Industrial automation information technology and control software
  • Automation equipment/accessories
  • Hardboard
  • Soft boards
  • Rigid and Flexible Boards
  • PCB Chemicals
  • Circuit board raw materials
  • Special equipment for circuit boards
  • Packaging equipment
  • PCB automation equipment
  • Environmental Treatment Equipment
  • Electronic Manufacturing Services
  • Electronic Components  
  • Semiconductor Packaging and Test Equipment
  • Semiconductor Materials
  • Semiconductor Packaging and Test Facilities

Visitors Profile

  • Automotive Electronics
  • Mobile Phone
  • Computer and Computer Peripherals
  • Household appliances
  • Wireless communication equipment and systems
  • Aerospace and military electronics
  • Automation and industrial control electronics
  • Audio-visual and digital electronics
  • Smart home and wearable products
  • Security Electronics
  • Medical Electronics & Equipment
  • LED Lighting
  • Rail Transportation
  • Service robots and drones
  • Instrumentation
  • Financial Electronics

Organizer & Supporters

Hosted by:

China Council for the Promotion of International Trade, Electronic Information Industry Sub-Council

Reed Exhibitions

Supporting Organizations:

  • Ministry of Industry and Information Technology of the People's Republic of China
  • China Council for the Promotion of International Trade
  • Chinese Institute of Electronics
  • China Electronics Corporation
  • China Electronics Technology Group
  • China Semiconductor Industry Association
  • Beijing Electronics Society SMT Committee
  •  SMT Committee of Shanghai Electronics Society
  • SMT Committee of Jiangsu Electronics Society
  • Shenzhen Processing Trade Association SMT Professional Committee
  • SMTA of America
  • China SMTA