October 27 - 29, 2026
Shenzhen World Exhibition & Convention Center (Baoan)

NEPCON Asia 2025 Onsite Events

Explore the forefront of electronic manufacturing at NEPCON Asia. Our conferences gather global experts and industry leaders to share insights on advanced packaging, intelligent manufacturing, AI applications, and emerging market trends. From hands-on skill competitions to cutting-edge technology forums, these events provide practical knowledge, innovation exchange, and a window into the future of electronics production.

SMTA China South Technology Conference

Selected popular and cutting-edge applications such as advanced packaging technology, ultra micro component assembly, and the application of big data in manufacturing. And invited international experts to bring a global perspective and share overseas introduction technology

Forum Date Time
SMTA China South Technology Conference
Oct 28
10:00-16:00

SMTA China South Vendor Conference

Focusing on cutting-edge equipment and technological innovation in the field of electronic manufacturing, gathering industry leaders and experts to explore hot topics in the electronic production industry such as how to improve production efficiency, ensure product quality, and reduce costs.

Forum Date Time
SMTA China South Vendor Conference
Oct 28
10:00-16:00

SMTA International Forum

Inviting technical experts from China, the United States, Japan, South Korea and other regions to create a truly global SMT international technology exchange conference, promoting the development and upgrading of global electronic manufacturing technology

Forum Date Time
SMTA International Forum
Oct 29
10:00-16:00

2025 (The 27th) Shenzhen Int'l IMT&SMT High-level Conference

Exploring the cutting-edge technology trends, process problem analysis, and future development directions of intelligent manufacturing and SMT technology

Forum Date Time
2025 (The 27th) Shenzhen Int'l IMT&SMT High-level Conference
Oct 29
10:00-16:00

Advanced Packaging Enabling Technologies and High-Reliability Development Forum

Process integration focuses on precision collaboration in intelligent equipment manufacturing and unified reliability standards for system integration. Through cross domain process parameter mutual learning and testing process sharing, it breaks down domain process barriers, achieves innovative breakthroughs from single equipment process optimization to cross-border scenario process collaboration, and builds a multi domain process integration ecosystem

Forum Date Time
Advanced Packaging Enabling Technologies and High-Reliability Development Forum
Oct 28
10:00-16:00

The 9th "Quick Cup" National Electronic Manufacturing Industry Welding Skills Competition in Guangdong

Attracted welding craftsmen from the electronic manufacturing industry to participate, providing a platform for grassroots industry practitioners to showcase themselves, and committed to improving the welding skills of the electronic manufacturing industry and promoting high-quality development of the industry.

Forum Date Time
The 9th "Quick Cup" National Electronic Manufacturing Industry Welding Skills Competition in Guangdong
Oct 28
10:00-16:00

“ESAMBER Cup” National Electronic Manufacturing Industry PCBA Failure Analysis and Repair Skills Competition

A comprehensive evaluation and scoring were conducted for each contestant's operation process, maintenance effectiveness, and problem-solving approach.

Forum Date Time
“ESAMBER Cup” National Electronic Manufacturing Industry PCBA Failure Analysis and Repair Skills Competition
Oct 28-30
10:00-16:00

The 5th “Hongkuai Cup” National Electronics Manufacturing Industry PCBA Design Competition Finals and Technical Exchange Meeting

The purpose of this competition is to "promote technology through competition, integrate innovation, tap into elites, and lead the future", focusing on cutting-edge technologies and engineering practices in PCB design, with the slogan of "showcasing talents and striving for excellence". Promote innovation and refinement in PCB design through a high-intensity and practical competitive platform

Forum Date Time
The 5th “Hongkuai Cup” National Electronics Manufacturing Industry PCBA Design Competition Finals and Technical Exchange Meeting
Oct 29-30
10:00-16:00

The 8th ICPF Semiconductor Technology and Innovation Conference 2025 Forum 1: SiP and Advanced Semiconductor Packaging & Test

Focusing on technological innovation and market trends in the fields of integrated circuits, memory, and sensors, promoting the upgrade from SiP to advanced packaging technology

Forum Date Time
The 8th ICPF Semiconductor Technology and Innovation Conference 2025 Forum 1: SiP and Advanced Semiconductor Packaging & Test
Oct 28
10:00-16:00

The 8th ICPF Semiconductor Technology and Innovation Conference 2025 Forum 2: Power Semiconductor Technology and Applications

Emerging markets such as new energy vehicles, charging stations, photovoltaics and energy storage, servers and data centers, drones, 5G, the Internet of Things, and AI bring new application scenarios and demands to the power semiconductor industry

Forum Date Time
The 8th ICPF Semiconductor Technology and Innovation Conference 2025 Forum 2: Power Semiconductor Technology and Applications
Oct 29
10:00-16:00

Automotive Electronics Manufacturing Technology Conference from strategy to implementation

Focusing on the manufacturing technology and innovation of radar, domain controller, sensor, electric drive control system, and on-board charger (OBC)

Forum Date Time
Automotive Electronics Manufacturing Technology Conference
Oct 29
10:00-16:00

National Electronics Manufacturing Industry Wiring Harness and Cable Manufacturing Skills Competition

The competition aims to enhance the craftsmanship and operational skills of cable production in the industry, ensuring product quality and reliability. Provided a platform for practitioners to exchange and learn, promoting technological innovation and experience sharing.

Forum Date Time
National Electronics Manufacturing Industry Wiring Harness and Cable Manufacturing Skills Competition
Oct 28-30
10:00-16:00

Tailored Intelligent Robot Manufacturing Technology Salon

Focusing on innovative manufacturing processes and technologies for core components such as embodied robots, motion control, frameless torque motors, six dimensional force sensors, and dexterous hands, as well as the application of embodied intelligence in industrial scenarios

Forum Date Time
Tailored Intelligent Robot Manufacturing Technology Salon
Oct 28-30
10:00-16:00

AI+Era: Theme Forum on Intelligent Factory and Reliability Improvement Solutions and Excellence Awards Ceremony

Explore the latest application practices and cutting-edge trends of AI technology in the entire electronic manufacturing chain, and share practical and feasible paths for intelligent factory construction and reliability assurance solutions. At the same time, we solemnly announce and commend outstanding products and enterprises that have achieved outstanding achievements, demonstrated innovation and leadership in the field of electronic manufacturing, set industry benchmarks, and jointly draw a development blueprint.

Forum Date Time
AI+Era: Theme Forum on Intelligent Factory and Reliability Improvement Solutions and Excellence Awards Ceremony
Oct 28
10:00-16:00

AI-Driven Smart Factory and Automation Innovation Forum

This forum focuses on AI’s innovative applications and future trends in electronic manufacturing, aiming to explore how AI can drive new transformation and growth.

Forum Date Time
AI-Driven Smart Factory and Automation Innovation Forum
Oct 28
10:00-16:00

AI Smart Glasses Industry Chain – Flexible Intelligent Manufacturing Trends conference

Taking "Ecosystem + Intelligent Manufacturing" as its dual-dimensional drivers,this summit will bring together key players across the industry chain. It aims to build a platform for technical exchange, trend insight, and collaborative cooperation for enterprises in the upstream and downstream of the smart glasses industry chain, thereby driving efficient industrial development.

Forum Date Time
AI Smart Glasses Industry Chain – Flexible Intelligent Manufacturing Trends conference
Oct 29
10:00-16:00

Industrial Components Empowering Intelligent Equipment Innovation Conference

Taking "Ecosystem + Intelligent Manufacturing" as its dual-dimensional drivers,this summit will bring together key players across the industry chain. It aims to build a platform for technical exchange, trend insight, and collaborative cooperation for enterprises in the upstream and downstream of the smart glasses industry chain, thereby driving efficient industrial development.

Forum Date Time
Industrial Components Empowering Intelligent Equipment Innovation Conference
TBC

NEPCON Asia International Tech Salon

NEPCON Asia International Tech Salon is specifically designed to foster global connections and provide a comprehensive understanding of the latest advancements in electronic production and manufacturing from China’s electronics manufacturing industry.

Forum Date Time
NEPCON Asia International Tech Salon
TBC