NEPCON ASIA 2025 is set to welcome over 600 leading exhibitors, including industry giants such as Yamaha, Hanwha, Fuji, Kurtz Ersa, Rehm, Tamura, EUNSUNG, TRI, Scienlab, UniTest, Ande, AXIS and more. The show will present hundreds of new products and solutions across key electronics manufacturing processes, including SMT, test and measurement, welding, dispensing and coating, semiconductor packaging and testing, automation, and supporting equipment.
An estimated 70,000 professional buyers will attend the show, including over 10,000 first-time buyers from trending industries such as automotive electronics, semiconductors, new energy, low-altitude flight, embodied robotics, and AI. This powerful mix will help companies break into emerging sectors and tap into blue ocean opportunities.
Featured Areas
Spotlight on Innovation – More Highlights to Come!
AI Smart Glasses Disassembly Area
Under the theme “Deconstructing in All Dimensions, Revealing the Future Vision”, this immersive area will explore the full innovation chain of AR/VR/AI glasses—from core components to end-use applications. Through a three-part experience of hardware Disassembly, technical decoding, and ecosystem dialogue, visitors will gain a comprehensive understanding of the technological logic and development trends shaping the smart glasses industry.
Flexible Manufacturing & Intelligent Conveying Area
Focusing on the application of maglev technology in fast-growing industries such as new energy, 3C electronics, and semiconductors, this themed area combines scenario-based showcases, forums, and exclusive buyer programs to highlight cutting-edge equipment and elevate exhibitor visibility and influence in flexible production.
NEPCON Low-Altitude Flight Core Components Disassembly Area
This area will showcase sensor modules, communication modules, motor drive systems, battery management systems, and other core components to offer visitors direct insight into product features and technical requirements across this emerging sector. It aims to drive collaboration and innovation across the value chain.
NEPCON Embodied Intelligence & Robotics Core Components Disassembly Area
Featuring live industrial and robotics demonstrations, this area focuses on control units, sensor modules, actuators, power management, and more. Supported by specialized salons and tech talks, it will offer deep dives into frontier topics and help companies anticipate and lead the next wave of development.
Electronic Product Automated Packaging Demonstration Area
According to Fortune Business Insights, the global automated packaging market is projected to reach USD 78.27 billion by 2025 and grow to USD 134.65 billion by 2032. While top-tier manufacturers are highly automated, many small to mid-sized electronics companies and OEMs still lag in packaging automation. This area will showcase best-in-class automation solutions for packaging, addressing both the massive retrofit demand and growing market needs, helping the industry advance into a new era of automated packaging.
IGBT & SiC Module Packaging and Testing Demonstration Area
This upgraded IGBT & SiC module demo area offers a fully operational packaging and testing production line, visually linking over 50 key process-stage devices. The immersive display is expected to draw over 200 packaging and testing enterprises and IDM technical teams, facilitating in-depth discussions on technical challenges and process innovation on-site.
Six Shows in One
Asia’s Premier Electronics Manufacturing Cluster
Integrating resources across electronics manufacturing, automotive, display, and new materials, NEPCON ASIA 2025 will bring together over 3,500 exhibitors across a massive 160,000 sqm exhibition matrix. With 165,000 cross-sector visitors expected, the event will connect electronics manufacturers directly with parts suppliers, display producers, and materials R&D teams, unlocking substantial business opportunities both at home and abroad.
Secure Your Booth Now — Limited Space Available
Exhibitor recruitment is now in full swing. Given the high demand and limited availability of premium booth locations, interested companies are strongly encouraged to register early to lock in their presence. Join 70,000+ professional buyers and decision-makers onsite and position your business ahead of the curve in Asia’s booming electronics ecosystem.
Join Us
https://ali2.infosalons.com.cn/reg/NEPCON25SZ/registeren/login?type=FNF78X
Book a Stand
CONTACT US
To Exhibit
Juila Gu
Tel: +86 21 2231 7010
Email: [email protected]
To Visit
Walden Li
Tel: +86 10 5933 9493
Mobile: +86 13651251335
Email: [email protected]
To Explore Market Cooperation：
Caroline Ye
Tel: +86 755 2383 4568
Mobile: + 86 134 2514 4880
Email: [email protected]