As global political and economic uncertainties grow and supply chains rapidly evolve, the electronics manufacturing industry worldwide is accelerating innovation and transformation to stay competitive. Cutting-edge technologies like AI, spatial computing, and humanoid robotics are set to reshape production processes and everyday applications, fueling new growth across industries.
NEPCON ASIA 2025 is expanding its scale once again—doubling the automation zone—to showcase the latest advancements and solutions driving this transformation. Join us from October 28-30, 2025, at Shenzhen World Exhibition & Convention Center (Bao’an), the heart of Asia’s electronics manufacturing ecosystem.
Connect with over 70,000 industry professionals from across Asia, discover emerging markets and technologies, meet key suppliers and partners, and build collaborations that will strengthen your global competitiveness in an ever-changing landscape. NEPCON ASIA is your gateway to the future of electronics manufacturing.
Ride the Wave of Opportunities: Unleashing Innovation
Hundreds of New Product Launches | High-Growth Markets | Emerging Sectors
As new technologies and hot topics continue to emerge, the electronic information manufacturing industry is seeing a clear trend toward high-end and intelligent development as a core pillar of new productive forces. NEPCON ASIA 2025 will showcase hundreds of new products and solutions across key electronics manufacturing processes, including SMT, testing and inspection, soldering, dispensing, semiconductor packaging and testing, automation, and supporting equipment.
Over 600 leading exhibitors, including Yamaha, Hanwha, Fuji, Kurtz Ersa, Rehm, Tamura, Heller, TRI, SZZT, UnionTech, Anda, and Axus, will compete on the same stage, with nearly 10,000 new buyers from high-growth sectors like automotive electronics, semiconductors, and new energy, as well as over 200 OSAT and IDM companies.
This year, NEPCON ASIA will place a special focus on emerging sectors such as low-altitude flight, embodied robotics, and AI, aiming to invite 2,000 new buyers in these areas, providing exhibitors with prime opportunities for layered exposure in new sectors and supporting businesses in expanding into blue ocean markets.
Breakthrough Areas: Driving Industry Advancement
Automation + AI + Low-Altitude Flight + Embodied Robotics + Semiconductors
Several innovative exhibition Areas will debut, bringing together supply chain resources and cutting-edge technologies. From packaging and testing process lines to flexible manufacturing and core components for end-use applications, visitors will experience the latest technologies and equipment across dimensions, supported by high-end onsite salons to help businesses explore technological frontiers and seize opportunities for breakthroughs.
AI Smart Glasses Disassembly Area
Keywords: Optical technology, chip and computing power, sensors, interaction technologies, battery technologies, lightweight materials
Under the theme “Deconstructing the Future Vision,” this immersive Area will present the entire industry chain from core components to end applications in AR/VR/AI glasses. Through hardware teardown, technical decoding, and ecosystem dialogues, the Area will showcase the underlying logic and trends in the smart glasses industry.
Flexible Manufacturing and Intelligent Transport System Area
Keywords: Maglev technology, transmission parts, flexible assembly, flexible manufacturing units, intelligent conveying modules, AGVs
Focusing on small-batch, multi-variety solutions for high-growth sectors such as 3C electronics, new energy, semiconductors, automotive electronics, and display panels, the Area will display cutting-edge flexible manufacturing technologies and equipment, helping production lines achieve higher efficiency and quality control.
NEPCON Low-Altitude Flight Core Components Disassembly Area
Keywords: Drones, eVTOL, sensor technologies, electronic control systems, power systems, structural components, flight control systems
The Area will display core components such as sensor modules, communication modules, motor drives, and battery management systems, providing a direct view into industry demands and product characteristics in emerging sectors to foster collaborative development and technological progress.
NEPCON Embodied Robotics Core Components Disassembly Area
Keywords: Reducers, sensors, controllers, LiDAR, power modules, industrial PCs, end-effectors, joint modules, navigation modules, batteries
With live industrial scenarios and robotics demonstrations, the Area will focus on core control units, sensor modules, actuators, and power management modules. Paired with specialized salons, it will deeply decode frontier topics to help enterprises capture trends in new sectors and achieve new growth heights.
Automated Packaging Demonstration Area for Electronic Finished Products
Keywords: Flexible packaging solutions, fully automated packaging equipment, secondary packaging equipment
According to Fortune Business Insights, the global packaging automation market is projected to reach USD 78.27 billion by 2025 and USD 134.65 billion by 2032. While leading manufacturers have achieved high levels of automation, many small to medium-sized enterprises and OEMs still need to enhance packaging automation. This demonstration Area will showcase premium equipment and technologies for automated packaging to capture the substantial market demand for both stock upgrades and incremental growth, accelerating the industry's transition toward automated packaging.
IGBT & SiC Module Packaging and Testing Demonstration Line
Keywords: Advanced packaging, SiC die attach and sintering, wire bonding and inspection, IGBT die attach
The upgraded demonstration line will present a complete live process for advanced packaging and testing, showcasing 50+ key equipment across process stages. This immersive display is expected to attract technical teams from over 200 OSAT and IDM companies for in-depth discussions on technical challenges and process upgrades.
Insightful Content, Deep Empowerment
40 Unmissable Conferences!
The 2025 conference program will cover hot topics, including advanced electronics manufacturing, integrated circuits and advanced packaging, power semiconductors, embodied robotics, artificial intelligence, automotive electronics, low-altitude flight, machine vision, and flexible manufacturing. Industry experts, leading company representatives, and association leaders will provide forward-looking insights for attendees from diverse fields.
To support global market expansion, the SMTA South China High-Tech Technical Workshop will invite experts from China, the US, Japan, Thailand, and more to analyze trends and advancements in electronics manufacturing from a global perspective.
Expanding Horizons, Tapping Global Opportunities
Factory Tours | Targeted Procurement Sessions | Overseas Salons
As the electronics manufacturing industry in Southeast Asia, the Middle East, and other emerging markets experiences rapid growth, domestic brands are prioritizing these regions to enhance the international competitiveness of "Made in China" products. NEPCON ASIA 2025 plans to invite approximately 1,800 overseas buyers from Thailand, Vietnam, Malaysia, Indonesia, and beyond.
By collaborating deeply with associations such as the Vietnam Electronics Industries Association (VEIA), the Indonesian Electronics Association, and the Thai Subcontracting Promotion Association, NEPCON ASIA will organize factory tours, targeted procurement sessions, and country day activities, becoming a key bridge for facilitating integration and exchanges between Chinese and global electronics manufacturers.
Secure Your Booth Now — Limited Space Available
Exhibitor recruitment is now in full swing. Given the high demand and limited availability of premium booth locations, interested companies are strongly encouraged to register early to lock in their presence. Join 70,000+ professional buyers and decision-makers onsite and position your business ahead of the curve in Asia’s booming electronics ecosystem.
Join Us
https://ali2.infosalons.com.cn/reg/NEPCON25SZ/registeren/login?type=FNF78X
Book a Stand
CONTACT US
To Exhibit
Juila Gu
Tel: +86 21 2231 7010
Email: [email protected]
To Visit
Walden Li
Tel: +86 10 5933 9493
Mobile: +86 13651251335
Email: [email protected]
To Explore Market Cooperation：
Caroline Ye
Tel: +86 755 2383 4568
Mobile: + 86 134 2514 4880
Email: [email protected]