Booth bookings are now officially open for NEPCON ASIA 2026, Asia’s premier electronics manufacturing exhibition. Expanding to an impressive 90,000 square meters, the event will serve as a one-stop hub for connecting upstream and downstream sectors—encompassing semiconductor components, intelligent assembly, and the fast-growing embodied intelligence segment—offering unparalleled access to all electronic business opportunities under one roof.

2026 has emerged as a pivotal year for AI innovation, with OpenClaw cementing its status as a global phenomenon by topping GitHub’s trending charts. A single task powered by this popular open-source project can consume hundreds of thousands to millions of Tokens, underscoring the exponential growth of AI infrastructure demand. According to IDC forecasts, the number of active global AI agents will surge to 2.216 billion by 2030, while annual Token consumption will skyrocket from 0.0005 Peta Tokens in 2025 to 152,000 Peta Tokens—a staggering increase of over 300 million times.

Against this backdrop, major domestic manufacturers of PCs, mobile phones, wearables, and other consumer electronics are accelerating the launch of Claw-like Agent AI products. This wave of innovation is poised to drive a qualitative leap in edge AI, unlocking an unprecedented growth window for the global electronics manufacturing supply chain.

Scheduled to take place from October 27 to 29, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an), NEPCON ASIA 2026 will gather a comprehensive array of electronics production buyers from across Asia. Covering key sectors including automotive electronics, automation & industrial control, mobile devices, home appliances, computing, embodied intelligence, low-altitude flight, AI, smart homes, and wearables, the exhibition is designed to help exhibitors capture incremental business opportunities, expand into emerging markets, connect with high-value new clients, and foster in-depth upstream-downstream collaboration—ultimately enhancing the global competitiveness of Asian and European electronics manufacturers.

*Photos from previous editions are available upon request.

Targeting Three High-Growth Sectors: AI, Automotive, and Semiconductors

1. Connecting with 9,000+ AI Hardware and Intelligent Terminal Buyers

The global AI hardware market is on track for explosive growth, with Coherent Market Insights projecting it will reach US$220.13 billion by 2033—boasting a compound annual growth rate (CAGR) of 16.4% from 2026 to 2033. NEPCON ASIA 2026 is positioned to capitalize on this momentum through an innovative ecosystem featuring multi-category AI product experiences, disassembly of complex AI devices, and technical seminars on AI manufacturing processes.

This unique approach will attract over 1,000 companies spanning AI hardware manufacturers, AI terminal OBMs, core component suppliers, EMS, and OEMs—covering the entire AI industry chain from R&D to mass production.

2. Engaging 13,000+ Automotive Electronics Professionals

As the global electric vehicle (EV) industry booms amid trade restructuring and energy transition, demand for automotive electronic hardware continues to surge. The performance and safety of automotive electronics depend heavily on the precision of electronic circuit manufacturing, making advanced manufacturing standards and process innovation critical to industry growth.

The Symposium on Advanced Manufacturing Standards and Electronic Circuit Process Innovation for Automotive Electronics will serve as a key platform, connecting over 13,000 automotive electronics buyers. Focused on full-process compliance and PCBA process upgrading for automotive applications, the symposium will delve into the implementation of core standards such as IATF 16949, AEC-Q, and ISO 26262. It will also address pain points in high-reliability automotive-grade PCBA assembly and share practical solutions for process optimization, reliability testing, and supply chain compliance—empowering deeper integration between electronics manufacturing and the automotive industry to tap into the 100-billion-level automotive electronics market.

3. Linking with 3,000+ Semiconductor Industry Buyers

Driven by strong demand for high-speed optical modules in AI infrastructure, LightCounting predicts that 800G and 1.6T optical modules will see rapid volume growth in 2026, with their combined Ethernet optical module market size exceeding US$22 billion by 2030—positioning them as future market leaders.

A highlight of NEPCON ASIA 2026 will be an innovative demonstration line for semiconductor packaging and testing processes, showcasing optical module and device packaging equipment, with on-site explanations of over 50 material and equipment brands. The concurrent 9th Semiconductor Technology and Innovation Conference Forum—co-organized by leading industry associations, Semiconductor Observer—will focus on integrated circuits and advanced packaging technologies for optical communication modules. It will attract key decision-makers from OSAT engineering, manufacturing, and R&D teams, IDM in-house packaging facilities, and EMS/OBM enterprises with SIP technology, facilitating connections with over 200 OSAT/IDM companies in South China.

Tapping New Opportunities: Targeted Invitations to Emerging Brands and New Factories

To address incremental market demand, the NEPCON team has launched a year-round buyer development initiative, conducting on-site visits and research across national electronics industry clusters, industrial parks, and manufacturing bases. This program focuses on identifying emerging OBM brands, new/expanded factories, and emerging consumer electronics players, building a comprehensive database of high-potential buyers and creating direct supply-demand links.

NEPCON ASIA 2026 will prioritize major new projects in South China, covering high-density circuit boards, photovoltaic energy storage equipment, semiconductor displays, and intelligent terminals—providing exhibitors with direct access to new production capacity and order opportunities. Additionally, the event will target emerging brands in AI headsets, smart glasses, electric mobility, and smart homes, helping exhibitors unlock new partnerships and capitalize on emerging market dividends.

Global Reach: Secure Asian and European Orders Without Leaving China

In March, China’s manufacturing purchasing volume index rebounded by 2.7 percentage points to 50.9%, signaling a recovery in enterprise production activities and strong resilience in high-quality development. With the continued expansion of 144-hour/240-hour visa-free transit policies, a record number of overseas buyers are expected to visit China in 2026.

NEPCON ASIA 2026 is strategically focusing on core Asian and Eastern European markets, including China, South Korea, Japan, Malaysia, Thailand, Vietnam, Hungary, Poland, the Czech Republic, Slovakia, and Romania. In collaboration with overseas authoritative industry associations, chambers of commerce, and media partners, the event aims to invite 3,000 high-value international buyers—enabling exhibitors to secure global orders and expand into Asian and European markets without international travel. Supporting services include exclusive international business receptions, overseas buyer factory tours, and one-on-one matchmaking to facilitate efficient cross-border cooperation.

New Special Show Debuts! Embodied Robots Empower Three High-potential Application Fields

ROBOTECH ASIA, Asia’s leading exhibition for embodied intelligence robotics applications and supply chains, will be held concurrently with NEPCON ASIA 2026 at the same venue. Featuring industry leaders such as LEJU Robot and ROKAE Robot, the exhibition will showcase cutting-edge innovations in robotics-electronics manufacturing integration. 2026 marks the dawn of large-scale mass production for embodied intelligence robots, positioning them as a core growth driver for the future of electronics manufacturing.

It will focus on the large-scale industrial application of embodied intelligence,with a deep focus on two key sectors—automotive manufacturing and electronics manufacturing—that were among the first to adopt "robotic screw-tightening" solutions and industrial automation. Meanwhile, the concurrent Embodied Intelligence Robotics Industry Development Conference will deeply link three high-potential application fields: automotive, electronics, and logistics, driving the mass deployment of ten-thousand-scale embodied intelligent automated production lines. It is expected to attract numerous factory decision-makers and senior executives who are focused on production line labor replacement solutions, providing a precise pathway for factories to upgrade to intelligent manufacturing.

Concurrent Cross-Border Shows: Maximizing Synergies Across the Industry Chain

Integrated with the ITWA Asia (Industrial Technology World Asia) Exhibition matrix, NEPCON ASIA 2026 will share a total exhibition area of 180,000 square meters and welcome over 170,000 professional visitors. Covering the entire electronics manufacturing value chain—from semiconductor components and intelligent assembly to advanced packaging, terminal manufacturing, core components, and complete machine mass production—the event spans electronics manufacturing, machine vision, smart factories, intelligent vehicles, new materials, embodied intelligence, and AI+AR smart glasses. This cross-sector integration delivers cross-border visitor traffic and diverse cooperation opportunities, enabling exhibitors to leverage shared buyer pools and double their business prospects.

365-Day Empowerment: Full-Cycle Support and Global Online Exposure

NEPCON’s 365-day full-cycle empowerment system ensures exhibition value extends beyond the event itself, delivering “pre-show momentum building, on-site activation, and global promotion” to realize “one exhibition, year-round benefits.”

•        Pre-show Momentum: The event will release industry insight reports, buyer procurement demands, new product previews, and a VIP buyer nomination program—helping exhibitors lock in high-quality clients in advance.

•        On-site Activation: On-site matchmaking, media/KOL live tours, and LED screen exposure will connect exhibitors with millions of online and on-site visitors.

•        Global Promotion: Partnering with over 200 domestic and international professional media outlets, the event will cover platforms including WeChat, Douyin, Twitter, and LinkedIn, with offline advertising in industrial parks, subways, and buses—delivering a total exposure of over 100 million times to help exhibitors build global brand recognition.

Secure Your Booth Today and Seize 2026’s Golden Opportunities

NEPCON ASIA 2026 will be held at the Shenzhen World Exhibition & Convention Center (Bao’an) from October 27 to 29, 2026. This is your chance to target the high-growth AI, automotive, and semiconductor sectors, connect with emerging domestic brands and new factories, expand your global reach in Asia and Europe, and leverage the concurrent embodied intelligence robotics exhibition and eight cross-sector shows to maximize industry synergies.

By gathering a full range of Asian electronics production buyers and showcasing advanced solutions in PCB assembly, smart factories, embodied intelligence, semiconductor packaging and testing, automotive electronics, and touch displays, NEPCON ASIA 2026 empowers exhibitors to capture incremental opportunities, expand into emerging markets, connect with high-value clients, and enhance their global competitiveness in the fast-evolving electronics manufacturing landscape.

Booth booking Inquiries:

Ms. Julia Gu | E: [email protected]

Media Cooperations:

Ms. Caroline Ye  | E: caroline.ye@rxglobal

Visitor & Delegation Inquiries

Mr. Walden Li | E: [email protected]