Held concurrently with NEPCON ASIA, S-Factory Expo explored advanced automation solutions in System Integration, Robotics, Smart Warehousing & Logistics. Motion Control, Transmission & Vision Components, Industrial Software
As an international trade and exchange platform, S-Factory Expo helps enterprises achieve digital and intelligent transformation with practical solutions.
Flexible Manufacturing and Intelligent Transport System Area
Featuring small-batch, high-mix flexible manufacturing and advanced technologies for 3C electronics, new energy, semiconductors, automotive electronics, and display panels, this zone is set to host 20 leading flexible manufacturing solution providers to help you boost production efficiency and quality control in your electronics manufacturing processes.
Electronic Product Automated Packaging Demonstration Area
Explore premium flexible packaging solutions, fully automated packaging machines, and secondary packaging equipment across key stages of final product packaging, driving the industry's shift toward advanced automated packaging.
AI-Driven Innovation Forums
AI-Driven Smart Factory and Automation Innovation Forum
October 28, 2025 | 10:30–17:00
Industrial Components Empowering Intelligent Equipment Innovation Conference
October 29, 2025 | 10:30–17:00
Key topics include:
- AI trends and applications in electronic manufacturing
- Factory automation driven by AI
- Digital twins in precision electronics
- AGV and MES integration
- Smart sensing and human-machine collaboration
- Efficient servo and drive technologies for precision manufacturing
These forums will help you gain practical insights into how AI and industrial components are driving new transformation and growth in electronics manufacturing.
Six Connected Shows, A Mega Feast of Innovation
- NEPCON ASIA: SMT, soldering, testing, dispensing, connectors, materials, and more
- S-Factory Expo: Smart factories, system integration, robotics, automation
- AWC: Smart and new energy vehicles, connected technologies
- C-TOUCH & DISPLAY SHENZHEN / FILM & TAPE EXPO: Display materials, processes, advanced film and tape
- IC PACKAGING FAIR: Advanced IC and semiconductor packaging equipment
Join Us in Shenzhen
Find suppliers and discover industry trends
Connect with technology leaders and peers
Gain insights, perks, and exclusive reports
Experience the latest in smart factory transformation, AI, and advanced automation
Join Us
https://ali2.infosalons.com.cn/reg/NEPCON25SZ/registeren/login?type=FNF78X
Book a Stand
CONTACT US
To Exhibit
Juila Gu
Tel: +86 21 2231 7010
Email: [email protected]
To Visit
Walden Li
Tel: +86 10 5933 9493
Mobile: +86 13651251335
Email: [email protected]
To Explore Market Cooperation：
Caroline Ye
Tel: +86 755 2383 4568
Mobile: + 86 134 2514 4880
Email: [email protected]