NEPCON ASIA , Asia’s premier exhibition for electronics manufacturing, will return in grand scale from October 28 to 30, 2025, at Shenzhen World Exhibition & Convention Center (Bao’an). The event will bring together top-tier electronics manufacturing buyers from across Asia, providing unmatched opportunities for businesses to capture new markets, connect with high-value clients, and build strategic partnerships across the global supply chain.
With a forward-looking approach, NEPCON ASIA 2025 focuses on three emerging industrial frontiers — Embodied Intelligence, Artificial Intelligence, and Low-Altitude Flight — highlighting how technological convergence is reshaping the future of smart manufacturing.
From Tech Warm-Up to Industry Breakthrough: China’s Embodied Intelligence Boom
In May, a series of landmark collaborations in Shenzhen signaled the accelerated industrialization of embodied intelligence technologies. These collaborations represent a leap from core component manufacturing to intelligent system integration. Advances in high-precision reducers and motion planning algorithms are enabling a new era of seamless human-machine collaboration. AI technologies are now restructuring the electronics industry’s value chain — driving new applications in AI servers, smart wearables, AI glasses, and AI-powered toys. AI also enhancing industrial scenarios like quality inspection and flexible production scheduling.
Low-Altitude Economy: Next-Gen Manufacturing Takes Flight
Low-altitude aerial mobility extends the boundaries of logistics and urban air mobility. Breakthroughs in carbon fiber composites and hydrogen fuel cell technologies are unlocking new possibilities for aircraft development, energizing the future of vertical take-off and landing (VTOL) platforms.
2,000+ Targeted Buyers from Emerging Tech Fields Expected Onsite
To support enterprises entering new high-growth sectors, NEPCON ASIA 2025 will invite over 2,000 targeted buyers from the humanoid robotics, AI hardware, and low-altitude flight industries. This includes executives and R&D leaders from leading global players such as:
- Huawei, Intel, Sony, Qualcomm, Sensata, Bosch, SoftBank Robotics
- Robotics pioneers like Boston Dynamics, Unitree Robotics, UBTECH, XbotPark, Ageless Innovation, and LOVOT
- AI and server tech companies including Dell, Lenovo, Inspur, H3C, Huawei Cloud
- Low-altitude innovators such as DJI, EHang, Xpeng AeroHT, Geely, China COMAC, Parrot, u-blox, and MagniX
Immersive Tech Zones: Unpacking the Future
To offer hands-on insights into these future industries, two dedicated themed zones will be featured onsite:
Humanoid Robot CoreParts Disassembly Area
Combines industrial and interactive demos to highlight:
- Core control units
- Sensor and actuator modules
- Power management systems
- Integration of control circuits
Accompanied by exclusive industry salons, this area will explore cutting-edge R&D topics and offer firsthand perspectives on robotics evolution.
Low-Altitude-Flying Core Components Disassembly Area
Presents teardown displays of UAV and eVTOL components, including:
- Sensor systems
- Communication modules
- Motor drives
- Battery management systems
This area will foster cross-industry collaboration, inspire new design ideas, and reveal technology trends shaping aerial mobility.
Secure Your Booth Now — Limited Space Available
Exhibitor recruitment is now in full swing. Given the high demand and limited availability of premium booth locations, interested companies are strongly encouraged to register early to lock in their presence. Join 70,000+ professional buyers and decision-makers onsite and position your business ahead of the curve in Asia’s booming electronics ecosystem.
Join Us
Book a Stand
CONTACT US
To Exhibit
Juila Gu
Tel: +86 21 2231 7010
Email: [email protected]
To Visit
Walden Li
Tel: +86 10 5933 9493
Mobile: +86 13651251335
Email: [email protected]
To Explore Market Cooperation：
Caroline Ye
Tel: +86 755 2383 4568
Mobile: + 86 134 2514 4880
Email: [email protected]